| Wide-band E-shaped patch antennas for wireless communications F Yang, XX Zhang, X Ye, Y Rahmat-Samii IEEE transactions on antennas and propagation 49 (7), 1094-1100, 2001 | 1319 | 2001 |
| Signal integrity design for high-speed digital circuits: Progress and directions J Fan, X Ye, J Kim, B Archambeault, A Orlandi IEEE Transactions on Electromagnetic Compatibility 52 (2), 392-400, 2010 | 299 | 2010 |
| Crosstalk cancellation and/or reduction X Ye US Patent 9,293,798, 2016 | 150 | 2016 |
| Impact of copper surface texture on loss: A model that works PG Huray, O Oluwafemi, J Loyer, E Bogatin, X Ye DesignCon 2010 1, 462-483, 2010 | 117 | 2010 |
| EMI mitigation with multilayer power-bus stacks and via stitching of reference planes X Ye, DA Hockanson, M Li, Y Ren, W Cui, JL Drewniak, RE DuBroff IEEE Transactions on electromagnetic compatibility 43 (4), 538-548, 2001 | 107 | 2001 |
| DC power-bus design using FDTD modeling with dispersive media and surface mount technology components X Ye, MY Koledintseva, M Li, JL Drewniak IEEE Transactions on Electromagnetic Compatibility 43 (4), 579-587, 2001 | 88 | 2001 |
| FDTD and experimental investigation of EMI from stacked-card PCB configurations DM Hockanson, X Ye, JL Drewniak, TH Hubing, TP Van Doren, ... IEEE transactions on electromagnetic compatibility 43 (1), 1-10, 2001 | 55 | 2001 |
| EMI resulting from signal via transitions through the DC power bus W Cui, X Ye, B Archambeault, D White, M Li, JL Drewniak IEEE International Symposium on Electromagnetic Compatibility. Symposium …, 2000 | 48 | 2000 |
| A novel de-embedding method suitable for transmission-line measurement B Chen, X Ye, B Samaras, J Fan 2015 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC), 1-4, 2015 | 42 | 2015 |
| Skew compensation by changing ground parasitic for traces C Ye, X Ye US Patent 7,450,396, 2008 | 42 | 2008 |
| Methods for minimizing the impedance discontinuity between a conductive trace and a component and structures formed thereby X Ye, D Miller, JD Bolen US Patent 7,034,544, 2006 | 38 | 2006 |
| Analytical and numerical sensitivity analyses of fixtures de-embedding B Chen, M Tsiklauri, C Wu, S Jin, J Fan, X Ye, B Samaras 2016 IEEE International Symposium on Electromagnetic Compatibility (EMC …, 2016 | 36 | 2016 |
| Comparison of TRL calibration vs. 2x thru de-embedding methods SJ Moon, X Ye, R Smith 2015 IEEE Symposium on Electromagnetic Compatibility and Signal Integrity …, 2015 | 34 | 2015 |
| Improved “Root-Omega” method for transmission-line-based material property extraction for multilayer PCBs S Jin, B Chen, X Fang, H Gao, X Ye, J Fan IEEE Transactions on Electromagnetic Compatibility 59 (4), 1356-1367, 2017 | 33 | 2017 |
| De-embedding errors due to inaccurate test fixture characterization X Ye IEEE Electromagnetic Compatibility Magazine 1 (4), 75-78, 2012 | 33 | 2012 |
| Incorporating two-port networks with S-parameters into FDTD X Ye, JL Drewniak IEEE microwave and wireless components letters 11 (2), 77-79, 2001 | 32 | 2001 |
| Thru-reflect-line calibration technique: Error analysis for characteristic impedance variations in the line standards L Ye, C Li, X Sun, S Jin, B Chen, X Ye, J Fan IEEE Transactions on Electromagnetic Compatibility 59 (3), 779-788, 2016 | 31 | 2016 |
| Multi-Ports ([) 2×-Thru De-Embedding: Theory, Validation, and Mode Conversion Characterization B Chen, J He, Y Guo, S Pan, X Ye, J Fan IEEE Transactions on Electromagnetic Compatibility 61 (4), 1261-1270, 2019 | 30 | 2019 |
| Validating the transmission-line based material property extraction procedure including surface roughness for multilayer PCBs using simulations S Jin, X Fang, B Chen, H Gao, X Ye, J Fan 2016 IEEE International Symposium on Electromagnetic Compatibility (EMC …, 2016 | 30 | 2016 |
| High-performance inter-PCB connectors: Analysis of EMI characteristics X Ye, JL Drewniak, J Nadolny, DM Hockanson IEEE transactions on electromagnetic compatibility 44 (1), 165-174, 2002 | 30 | 2002 |
