Get my own profile
Public access
View all1 article
0 articles
available
not available
Based on funding mandates
Co-authors
Dan DrepsIBMVerified email at us.ibm.com
Arun JosephIBM | Electronic Design AutomationVerified email at in.ibm.com
Prasanna JayaramanHardware Engineer, IntelVerified email at intel.com
Wiren BeckerIBMVerified email at ieee.org
Madhavan SwaminathanJohn Pippin Chair in Microsystems Packaging and Electromagnetics, School of ECEVerified email at ece.gatech.edu
Jinwoo ChoiIBM Master Inventor and Modeling Team Leader, IBM Corporation and IEEE EMC Distinguished ReviewerVerified email at us.ibm.com
Rahul M RaoIBMVerified email at in.ibm.com
Charles LefurgyIBMVerified email at us.ibm.com
Giulio AntoniniFull Professor at Universitā degli Studi dell'AquilaVerified email at univaq.it
Spandana RachamallaIBMVerified email at in.ibm.com
Saravanan SethuramanIntel CorporationVerified email at intel.com
diwesh pandeyIBMVerified email at in.ibm.com
Jörg HenkelProfessor of Computer Science, Karlsruhe Institute of TechnologyVerified email at kit.edu
Houman HomayounUniversity of California DavisVerified email at ucdavis.edu
Muhammad ShafiqueProfessor, Electrical and Computer Engineering, New York University Abu Dhabi (NYUAD), NYUVerified email at nyu.edu
Amlan GangulyAssociate Professor of Computer Engineering, Rochester Institute of TechnologyVerified email at rit.edu
Premjeet ChahalProfessor, Michigan State UniversityVerified email at msu.edu
Mark G. AllenProfessor of Electrical and Systems Engineering, University of PennsylvaniaVerified email at upenn.edu
Rao TummalaVerified email at ece.gatech.edu
Anil LingambudiIntelVerified email at intel.com