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Joungho Kim
Joungho Kim
Professor of Electrical Engineering KAIST
Verified email at kaist.ac.kr - Homepage
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Cited by
Year
Coil design and shielding methods for a magnetic resonant wireless power transfer system
J Kim, J Kim, S Kong, H Kim, IS Suh, NP Suh, DH Cho, J Kim, S Ahn
Proceedings of the IEEE 101 (6), 1332-1342, 2013
5812013
High-Frequency Scalable Electrical Model and Analysis of Through Silicon Via (TSV)
J Kim, JS Pak, J Cho, E Song, J Cho, H Kim, T Song, J Lee, H Lee, K Park, ...
Components, Packaging and Manufacturing Technology, IEEE Transactions on 1 …, 2011
4902011
Power distribution networks for system-on-package: Status and challenges
M Swaminathan, J Kim, I Novak, JP Libous
IEEE Transactions on Advanced Packaging 27 (2), 286-300, 2004
3342004
Development and evaluation of 3-D SiP with vertically interconnected through silicon vias (TSV)
DM Jang, C Ryu, KY Lee, BH Cho, J Kim, TS Oh, WJ Lee, J Yu
2007 proceedings 57th electronic components and technology conference, 847-852, 2007
2422007
Coil design and measurements of automotive magnetic resonant wireless charging system for high-efficiency and low magnetic field leakage
H Kim, C Song, DH Kim, DH Jung, IM Kim, YI Kim, J Kim, S Ahn, J Kim
IEEE Transactions on Microwave Theory and Techniques 64 (2), 383-400, 2016
2222016
3D-MAPS: 3D massively parallel processor with stacked memory
SK Lim, SK Lim
Design for High Performance, Low Power, and Reliable 3D Integrated Circuits …, 2013
2212013
Modeling and Analysis of Through Silicon Via (TSV) Noise Coupling and Suppression Using a Guard Ring
J Cho, E Song, K Yoon, JS Pak, J Kim, W Lee, T Song, K Kim, J Lee, ...
Components, Packaging and Manufacturing Technology, IEEE Transactions on 1 …, 2011
1872011
Magnetic field design for high efficient and low EMF wireless power transfer in on-line electric vehicle
S Ahn, J Kim
Proceedings of the 5th European Conference on Antennas and Propagation …, 2011
1802011
PDN Impedance Modeling and Analysis of a 3D TSV IC by Using a Proposed P/G TSV Array Model based on Separated P/G TSV and Chip-PDN Models
JS Pak, J Kim, J Cho, K Kim, T Song, S Ahn, J Lee, H Lee, K Park, J Kim
Components, Packaging and Manufacturing Technology, IEEE Transactions on 1 …, 2011
1522011
Low frequency electromagnetic field reduction techniques for the on-line electric vehicle (OLEV)
S Ahn, J Pak, T Song, H Lee, JG Byun, D Kang, CS Choi, E Kim, J Ryu, ...
2010 IEEE International Symposium on Electromagnetic Compatibility, 625-630, 2010
1522010
Circuital modeling and measurement of shielding effectiveness against oblique incident plane wave on apertures in multiple sides of rectangular enclosure
J Shim, DG Kam, JH Kwon, J Kim
IEEE transactions on electromagnetic compatibility 52 (3), 566-577, 2010
1292010
Full-chip TSV-to-TSV coupling analysis and optimization in 3D IC
C Liu, T Song, J Cho, J Kim, J Kim, SK Lim
Proceedings of the 48th Design Automation Conference, 783-788, 2011
1212011
Electrical characterization of trough silicon via (TSV) depending on structural and material parameters based on 3D full wave simulation
JS Pak, C Ryu, J Kim
2007 International Conference on Electronic Materials and Packaging, 1-6, 2007
1212007
EMI reduction methods in wireless power transfer system for drone electrical charger using tightly coupled three-phase resonant magnetic field
C Song, H Kim, Y Kim, D Kim, S Jeong, Y Cho, S Lee, S Ahn, J Kim
IEEE Transactions on Industrial Electronics 65 (9), 6839-6849, 2018
1162018
Chip-package hierarchical power distribution network modeling and analysis based on a segmentation method
J Kim, W Lee, Y Shim, J Shim, K Kim, JS Pak, J Kim
IEEE Transactions on advanced packaging 33 (3), 647-659, 2010
1132010
High frequency electrical model of through wafer via for 3-D stacked chip packaging
C Ryu, J Lee, H Lee, K Lee, T Oh, J Kim
2006 1st Electronic Systemintegration Technology Conference 1, 215-220, 2006
1062006
Modeling and analysis of coupling between TSVs, metal, and RDL interconnects in TSV-based 3D IC with silicon interposer
K Yoon, G Kim, W Lee, T Song, J Lee, H Lee, K Park, J Kim
2009 11th Electronics Packaging Technology Conference, 702-706, 2009
1032009
Modeling and measurement of simultaneous switching noise coupling through signal via transition
J Park, H Kim, Y Jeong, J Kim, JS Pak, DG Kam, J Kim
IEEE Transactions on Advanced Packaging 29 (3), 548-559, 2006
882006
Suppression of leakage magnetic field from a wireless power transfer system using ferrimagnetic material and metallic shielding
H Kim, J Cho, S Ahn, J Kim, J Kim
2012 IEEE International Symposium on Electromagnetic Compatibility, 640-645, 2012
862012
System-on-package ultra-wideband transmitter using CMOS impulse generator
J Lee, YJ Park, M Kim, C Yoon, J Kim, KH Kim
IEEE Transactions on microwave theory and techniques 54 (4), 1667-1674, 2006
862006
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