| Study of non-isothermal liquid evaporation in synthetic micro-pore structures with hybrid lattice Boltzmann model F Qin, L Del Carro, AM Moqaddam, Q Kang, T Brunschwiler, D Derome, ... Journal of Fluid Mechanics 866, 33-60, 2019 | 55 | 2019 |
| All-copper flip chip interconnects by pressureless and low temperature nanoparticle sintering J Zürcher, L Del Carro, G Schlottig, DN Wright, ASB Vardøy, MMV Taklo, ... 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 343-349, 2016 | 32 | 2016 |
| Controlled 3D nanoparticle deposition by drying of colloidal suspension in designed thin micro-porous architectures F Qin, M Su, J Zhao, AM Moqaddam, L Del Carro, T Brunschwiler, Q Kang, ... International Journal of Heat and Mass Transfer 158, 120000, 2020 | 22 | 2020 |
| Review on percolating and neck-based underfills for three-dimensional chip stacks T Brunschwiler, J Zürcher, L Del Carro, G Schlottig, B Burg, ... Journal of Electronic Packaging 138 (4), 041009, 2016 | 19 | 2016 |
| Review on percolating and neck-based underfills for three-dimensional chip stacks T Brunschwiler, J Zürcher, L Del Carro, G Schlottig, B Burg, ... Journal of Electronic Packaging 138 (4), 041009, 2016 | 19 | 2016 |
| Tricoupled hybrid lattice Boltzmann model for nonisothermal drying of colloidal suspensions in micropore structures F Qin, AM Moqaddam, L Del Carro, Q Kang, T Brunschwiler, D Derome, ... Physical Review E 99 (5), 053306, 2019 | 18 | 2019 |
| Low-temperature dip-based all-copper interconnects formed by pressure-assisted sintering of copper nanoparticles L Del Carro, J Zürcher, U Drechsler, IE Clark, G Ramos, T Brunschwiler IEEE Transactions on Components, Packaging and Manufacturing Technology 9 (8 …, 2019 | 18 | 2019 |
| Oxide-free copper pastes for the attachment of large-area power devices L Del Carro, AA Zinn, P Ruch, F Bouville, AR Studart, T Brunschwiler Journal of Electronic Materials 48, 6823-6834, 2019 | 16 | 2019 |
| Laser sintering of dip-based all-copper interconnects L Del Carro, M Kossatz, L Schnackenberg, M Fettke, I Clark, ... 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 279-286, 2018 | 13 | 2018 |
| Morphology of low-temperature all-copper interconnects formed by dip transfer L Del Carro, J Zürcher, S Gerke, T Wildsmith, G Ramos, T Brunschwiler 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 961-967, 2017 | 10 | 2017 |
| Thermally conductive composite material with percolating microparticles applied as underfill R Straessle, S Zimmermann, L Del Carro, J Zürcher, G Schlottig, A Achen, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 8 (5 …, 2017 | 6 | 2017 |
| Direct investigation of microparticle self-assembly to improve the robustness of neck formation in thermal underfills R Stadler, L Del Carro, J Zürcher, G Schlottig, AR Studart, T Brunschwiler 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2017 | 6 | 2017 |
| On the evaporation of colloidal suspensions in confined pillar arrays J Zürcher, BR Burg, L Del Carro, AR Studart, T Brunschwiler Transport in Porous Media 125 (2), 173-192, 2018 | 5 | 2018 |
| Sintering of copper nanoparticle pastes for microelectronic packaging L Del Carro ETH Zurich, 2018 | 3 | 2018 |
| Relief printing of micron-sized electrical conductive structures on silicon S Gerke, J Zürcher, L Del Carro, X Chen, T Brunschwiler Flexible and Printed Electronics 2 (1), 014004, 2017 | 3 | 2017 |
| Chip packages with sintered interconnects formed out of pads TJ Brunschwiler, L Del Carro, J Zürcher US Patent 10,777,496, 2020 | 2 | 2020 |
| Particle-based, anisotropic composite materials for magnetic cores ARM Sridhar, T Brunschwiler, S Ye, L Del Carro, JO Ammann US Patent 11,158,450, 2021 | 1 | 2021 |
| Sintering of oxide-free copper pastes for the attachment of SiC power devices L Del Carro, C Liu, F Koller, AA Zinn, T Brunschwiler 2019 22nd European Microelectronics and Packaging Conference & Exhibition …, 2019 | 1 | 2019 |
| Anisotropic composite core material for inductor-based fully integrated voltage regulator S Ye, A Sridhar, L Del Carro, P McCloskey, A Masood, T Brunschwiler 2019 22nd European Microelectronics and Packaging Conference & Exhibition …, 2019 | 1 | 2019 |
| Scalable packaging platform supporting high-performance 3D chip stacks T Brunschwiler, G Schlottig, A Sridhar, A La Porta, O Ozsun, J Zürcher, ... 2017 Pan Pacific Microelectronics Symposium (Pan Pacific), 1-7, 2017 | 1 | 2017 |
