Yao-Jiang Zhang
Title
Cited by
Cited by
Year
Physics-based via and trace models for efficient link simulation on multilayer structures up to 40 GHz
R Rimolo-Donadio, X Gu, YH Kwark, MB Ritter, B Archambeault, ...
IEEE Transactions on Microwave Theory and Techniques 57 (8), 2072-2083, 2009
1492009
Progress review of electromagnetic compatibility analysis technologies for packages, printed circuit boards, and novel interconnects
EP Li, XC Wei, AC Cangellaris, EX Liu, YJ Zhang, M D'amore, J Kim, ...
IEEE Transactions on Electromagnetic Compatibility 52 (2), 248-265, 2010
1462010
Analytical evaluation of via-plate capacitance for multilayer printed circuit boards and packages
Y Zhang, J Fan, G Selli, M Cocchini, F de Paulis
IEEE Transactions on Microwave Theory and Techniques 56 (9), 2118-2128, 2008
1442008
An efficient approach for power delivery network design with closed-form expressions for parasitic interconnect inductances
C Wang, J Mao, G Selli, S Luan, L Zhang, J Fan, DJ Pommerenke, ...
IEEE Transactions on Advanced Packaging 29 (2), 320-334, 2006
1282006
An intrinsic circuit model for multiple vias in an irregular plate pair through rigorous electromagnetic analysis
YJ Zhang, J Fan
IEEE transactions on microwave theory and techniques 58 (8), 2251-2265, 2010
832010
Signal/power integrity analysis for multilayer printed circuit boards using cascaded S-parameters
F De Paulis, YJ Zhang, J Fan
IEEE transactions on electromagnetic compatibility 52 (4), 1008-1018, 2010
612010
Estimating radio-frequency interference to an antenna due to near-field coupling using decomposition method based on reciprocity
H Wang, V Khilkevich, YJ Zhang, J Fan
IEEE transactions on electromagnetic compatibility 55 (6), 1125-1131, 2013
572013
A novel impedance definition of a parallel plate pair for an intrinsic via circuit model
YJ Zhang, G Feng, J Fan
IEEE transactions on microwave theory and techniques 58 (12), 3780-3789, 2010
512010
A semi-analytical approach for system-level electrical modeling of electronic packages with large number of vias
ZZ Oo, EX Liu, EP Li, X Wei, Y Zhang, M Tan, LWJ Li, R Vahldieck
IEEE transactions on advanced packaging 31 (2), 267-274, 2008
502008
Modeling of ferrite-based materials for shielding enclosures
M Koledintseva, J Drewniak, Y Zhang, J Lenn, M Thoms
Journal of Magnetism and Magnetic Materials 321 (7), 730-733, 2009
422009
Accuracy of physics-based via models for simulation of dense via arrays
S Müller, X Duan, M Kotzev, YJ Zhang, J Fan, X Gu, YH Kwark, ...
IEEE transactions on electromagnetic compatibility 54 (5), 1125-1136, 2012
402012
Novel methods for modeling of multiple vias in multilayered parallel-plate structures
EX Liu, EP Li, ZZ Oo, X Wei, Y Zhang, R Vahldieck
IEEE transactions on microwave theory and techniques 57 (7), 1724-1733, 2009
402009
Far-field prediction using only magnetic near-field scanning for EMI test
X Gao, J Fan, Y Zhang, H Kajbaf, D Pommerenke
IEEE transactions on electromagnetic compatibility 56 (6), 1335-1343, 2014
362014
Probable aerosol transmission of severe fever with thrombocytopenia syndrome virus in southeastern China
Z Gong, S Gu, Y Zhang, J Sun, X Wu, F Ling, W Shi, P Zhang, D Li, H Mao, ...
Clinical Microbiology and Infection 21 (12), 1115-1120, 2015
342015
A magnetic-field resonant probe with enhanced sensitivity for RF interference applications
HH Chuang, GH Li, E Song, HH Park, HT Jang, HB Park, YJ Zhang, ...
IEEE transactions on electromagnetic compatibility 55 (6), 991-998, 2013
332013
Systematic microwave network analysis for multilayer printed circuit boards with vias and decoupling capacitors
YJ Zhang, ZZ Oo, XC Wei, EX Liu, J Fan, EP Li
IEEE Transactions on Electromagnetic Compatibility 52 (2), 401-409, 2010
322010
Fast multipole accelerated scattering matrix method for multiple scattering of a large number of cylinders
YJ Zhang, EP Li
Progress In Electromagnetics Research 72, 105-126, 2007
302007
The hybridization of fast multipole method with asymptotic waveform evaluation for the fast monostatic RCS computation
XC Wei, YJ Zhang, EP Li
IEEE Transactions on Antennas and Propagation 52 (2), 605-607, 2004
292004
An efficient hybrid finite-element analysis of multiple vias sharing the same anti-pad in an arbitrarily shaped parallel-plate pair
YJ Zhang, L Ren, D Liu, S De, X Gu, YH Kwark, C Schuster, J Fan
IEEE Transactions on Microwave Theory and Techniques 63 (3), 883-890, 2015
222015
A generalized multiple scattering method for dense vias with axially anisotropic modes in an arbitrarily shaped plate pair
YJ Zhang, J Fan
IEEE transactions on microwave theory and techniques 60 (7), 2035-2045, 2012
222012
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Articles 1–20