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Yao-Jiang Zhang
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Progress review of electromagnetic compatibility analysis technologies for packages, printed circuit boards, and novel interconnects
EP Li, XC Wei, AC Cangellaris, EX Liu, YJ Zhang, M D'amore, J Kim, ...
IEEE Transactions on Electromagnetic Compatibility 52 (2), 248-265, 2010
1732010
Physics-based via and trace models for efficient link simulation on multilayer structures up to 40 GHz
R Rimolo-Donadio, X Gu, YH Kwark, MB Ritter, B Archambeault, ...
IEEE Transactions on Microwave Theory and Techniques 57 (8), 2072-2083, 2009
1712009
Analytical evaluation of via-plate capacitance for multilayer printed circuit boards and packages
Y Zhang, J Fan, G Selli, M Cocchini, F de Paulis
IEEE Transactions on Microwave Theory and Techniques 56 (9), 2118-2128, 2008
1542008
An intrinsic circuit model for multiple vias in an irregular plate pair through rigorous electromagnetic analysis
YJ Zhang, J Fan
IEEE transactions on microwave theory and techniques 58 (8), 2251-2265, 2010
882010
Signal/power integrity analysis for multilayer printed circuit boards using cascaded S-parameters
F De Paulis, YJ Zhang, J Fan
IEEE Transactions on Electromagnetic Compatibility 52 (4), 1008-1018, 2010
712010
Estimating radio-frequency interference to an antenna due to near-field coupling using decomposition method based on reciprocity
H Wang, V Khilkevich, YJ Zhang, J Fan
IEEE Transactions on Electromagnetic Compatibility 55 (6), 1125-1131, 2013
702013
Probable aerosol transmission of severe fever with thrombocytopenia syndrome virus in southeastern China
Z Gong, S Gu, Y Zhang, J Sun, X Wu, F Ling, W Shi, P Zhang, D Li, H Mao, ...
Clinical Microbiology and Infection 21 (12), 1115-1120, 2015
662015
A novel impedance definition of a parallel plate pair for an intrinsic via circuit model
YJ Zhang, G Feng, J Fan
IEEE transactions on microwave theory and techniques 58 (12), 3780-3789, 2010
582010
A magnetic-field resonant probe with enhanced sensitivity for RF interference applications
HH Chuang, GH Li, E Song, HH Park, HT Jang, HB Park, YJ Zhang, ...
IEEE transactions on electromagnetic compatibility 55 (6), 991-998, 2013
532013
A semi-analytical approach for system-level electrical modeling of electronic packages with large number of vias
ZZ Oo, EX Liu, EP Li, X Wei, Y Zhang, M Tan, LWJ Li, R Vahldieck
IEEE transactions on advanced packaging 31 (2), 267-274, 2008
512008
Far-field prediction using only magnetic near-field scanning for EMI test
X Gao, J Fan, Y Zhang, H Kajbaf, D Pommerenke
IEEE transactions on electromagnetic compatibility 56 (6), 1335-1343, 2014
502014
Accuracy of physics-based via models for simulation of dense via arrays
S Müller, X Duan, M Kotzev, YJ Zhang, J Fan, X Gu, YH Kwark, ...
IEEE transactions on electromagnetic compatibility 54 (5), 1125-1136, 2012
482012
Modeling of ferrite-based materials for shielding enclosures
M Koledintseva, J Drewniak, Y Zhang, J Lenn, M Thoms
Journal of Magnetism and Magnetic Materials 321 (7), 730-733, 2009
472009
Novel methods for modeling of multiple vias in multilayered parallel-plate structures
EX Liu, EP Li, ZZ Oo, X Wei, Y Zhang, R Vahldieck
IEEE transactions on microwave theory and techniques 57 (7), 1724-1733, 2009
432009
Systematic microwave network analysis for multilayer printed circuit boards with vias and decoupling capacitors
YJ Zhang, ZZ Oo, XC Wei, EX Liu, J Fan, EP Li
IEEE Transactions on Electromagnetic Compatibility 52 (2), 401-409, 2010
392010
The hybridization of fast multipole method with asymptotic waveform evaluation for the fast monostatic RCS computation
XC Wei, YJ Zhang, EP Li
IEEE Transactions on Antennas and Propagation 52 (2), 605-607, 2004
332004
A passive intermodulation source identification measurement system using a vibration modulation method
S Yang, W Wu, S Xu, YJ Zhang, D Stutts, DJ Pommerenke
IEEE Transactions on Electromagnetic compatibility 59 (6), 1677-1684, 2017
322017
Near-field coupling estimation by source reconstruction and Huygens's equivalence principle
L Li, J Pan, C Hwang, G Cho, H Park, Y Zhang, J Fan
2015 IEEE Symposium on Electromagnetic Compatibility and Signal Integrity …, 2015
322015
Fast multipole accelerated scattering matrix method for multiple scattering of a large number of cylinders
YJ Zhang, EP Li
Progress In Electromagnetics Research 72, 105-126, 2007
322007
Complex permittivity and permeability measurements and finite-difference time-domain simulation of ferrite materials
J Xu, MY Koledintseva, Y Zhang, Y He, B Matlin, RE DuBroff, JL Drewniak, ...
IEEE transactions on electromagnetic compatibility 52 (4), 878-887, 2010
302010
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