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- Kenneth E. GoodsonStanford Mechanical Engineering, Davies Provostial ProfessorVerified email at stanford.edu
- Mehdi AsheghiAdjunct Professor of Mechanical Engineerig, Stanford UniversityVerified email at stanford.edu
- Gang ChenProfessor, Mechanical Engineering, massachusetts institute of technologyVerified email at mit.edu
- Rajath KantharajMechanical Engineer, Intel CorporationVerified email at intel.com
- Namiko YamamotoPenn State UniversityVerified email at psu.edu
- Hadi GhasemiUniversity of Houston, MIT, UofTVerified email at uh.edu
- George NiMITVerified email at mit.edu
- Albraa A. AlsaatiPurdue UniversityVerified email at purdue.edu
- Justin A. WeibelPurdue UniversityVerified email at purdue.edu
- Michael T BarakoSenior Staff Scientist, NG Next Basic Research Laboratory, Northrop Grumman Space SystemsVerified email at NorthropGrummanNext.net
- Nenad MiljkovicUniversity of Illinois at Urbana-ChampaignVerified email at illinois.edu
- Selcuk YerciElectrical and Electronics Engineering, ODTU-GUNAM, METUVerified email at metu.edu.tr
- Yuqiang ZengSouthern University of Science and Technology. (Previously LBNL & Purdue University)Verified email at sustech.edu.cn
- Woosung ParkMechanical Engineering, Hanyang UniversityVerified email at hanyang.ac.kr
- Aaditya CandadaiPackaging R&D Engineer, Intel CorporationVerified email at intel.com
- Hai M. DuongAssoc Professor, Mechanical Engineering, National University of Singapore (NUS)Verified email at nus.edu.sg
- Brian L. WardleProfessor of Aeronautics and Astronautics, Massachusetts Institute of TechnologyVerified email at MIT.EDU
- Yuan GaoLieber Institute for Brain Development/Department of Biomedical Engineering, Johns HopkinsVerified email at libd.org
- Ali ShakouriProfessor of Electrical and Computer Engineering, Purdue UniversityVerified email at purdue.edu
- Aalok GaitondePurdue University; Apple; 3D SystemsVerified email at purdue.edu