| Superconformal electrodeposition of copper in 500–90 nm features TP Moffat, JE Bonevich, WH Huber, A Stanishevsky, DR Kelly, GR Stafford, ... Journal of The Electrochemical Society 147 (12), 4524, 2000 | 581 | 2000 |
| Superconformal film growth: Mechanism and quantification TP Moffat, D Wheeler, MD Edelstein, D Josell IBM Journal of Research and Development 49 (1), 19-36, 2005 | 464 | 2005 |
| Superconformal electrodeposition of copper TP Moffat, D Wheeler, WH Huber, D Josell Electrochemical and Solid-State Letters 4 (4), C26, 2001 | 438 | 2001 |
| Electrodeposition of copper in the SPS-PEG-Cl additive system: I. kinetic measurements: Influence of SPS TP Moffat, D Wheeler, D Josell Journal of The Electrochemical Society 151 (4), C262, 2004 | 399 | 2004 |
| H2 evolution at Si-based metal–insulator–semiconductor photoelectrodes enhanced by inversion channel charge collection and H spillover DV Esposito, I Levin, TP Moffat, AA Talin Nature materials 12 (6), 562-568, 2013 | 330 | 2013 |
| Self-terminating growth of platinum films by electrochemical deposition Y Liu, D Gokcen, U Bertocci, TP Moffat Science 338 (6112), 1327-1330, 2012 | 249 | 2012 |
| Superconformal electrodeposition in submicron features D Josell, D Wheeler, WH Huber, TP Moffat Physical Review Letters 87 (1), 016102, 2001 | 227 | 2001 |
| Extreme bottom-up superfilling of through-silicon-vias by damascene processing: suppressor disruption, positive feedback and turing patterns TP Moffat, D Josell Journal of The Electrochemical Society 159 (4), D208, 2012 | 224 | 2012 |
| An electrochemical and X‐Ray photoelectron spectroscopy study of the passive state of chromium TP Moffat, RM Latanision Journal of the Electrochemical Society 139 (7), 1869, 1992 | 214 | 1992 |
| Seedless superfill: Copper electrodeposition in trenches with ruthenium barriers D Josell, D Wheeler, C Witt, TP Moffat Electrochemical and solid-state letters 6 (10), C143, 2003 | 194 | 2003 |
| A simple equation for predicting superconformal electrodeposition in submicrometer trenches D Josell, D Wheeler, WH Huber, JE Bonevich, TP Moffat Journal of the Electrochemical Society 148 (12), C767, 2001 | 192 | 2001 |
| Modeling superconformal electrodeposition using the level set method D Wheeler, D Josell, TP Moffat Journal of The Electrochemical Society 150 (5), C302, 2003 | 172 | 2003 |
| Curvature enhanced adsorbate coverage mechanism for bottom-up superfilling and bump control in damascene processing TP Moffat, D Wheeler, SK Kim, D Josell Electrochimica Acta 53 (1), 145-154, 2007 | 171 | 2007 |
| Electrochemical and scanning tunneling microscopic study of dealloying of Cu3Au TP Moffat, FRF Fan, AJ Bard Journal of the Electrochemical Society 138 (11), 3224, 1991 | 171 | 1991 |
| Curvature enhanced adsorbate coverage model for electrodeposition TP Moffat, D Wheeler, SK Kim, D Josell Journal of the Electrochemical Society 153 (2), C127, 2006 | 168 | 2006 |
| Electrodeposition of Cu on Ru barrier layers for damascene processing TP Moffat, M Walker, PJ Chen, JE Bonevich, WF Egelhoff, L Richter, C Witt, ... Journal of the Electrochemical Society 153 (1), C37, 2005 | 163 | 2005 |
| Electrodeposition of Cu in the PEI-PEG-Cl-SPS additive system: reduction of overfill bump formation during superfilling SK Kim, D Josell, TP Moffat Journal of The Electrochemical Society 153 (9), C616, 2006 | 159 | 2006 |
| Modeling extreme bottom-up filling of through silicon vias D Josell, D Wheeler, TP Moffat Journal of the Electrochemical Society 159 (10), D570, 2012 | 116 | 2012 |
| Artifacts in ballistic magnetoresistance measurements WF Egelhoff Jr, L Gan, H Ettedgui, Y Kadmon, CJ Powell, PJ Chen, ... Journal of applied physics 95 (11), 7554-7559, 2004 | 116 | 2004 |
| Electrodeposition of Al‐Cr metallic glass TP Moffat Journal of the Electrochemical Society 141 (9), L115, 1994 | 112 | 1994 |
