Boping Wu
Cited by
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Is 25 Gb/s on-board signaling viable?
DG Kam, MB Ritter, TJ Beukema, JF Bulzacchelli, PK Pepeljugoski, ...
IEEE Transactions on advanced packaging 32 (2), 328-344, 2009
Application of the Foldy–Lax multiple scattering method to the analysis of vias in ball grid arrays and interior layers of printed circuit boards
CJ Ong, D Miller, L Tsang, B Wu, CC Huang
Microwave and optical technology letters 49 (1), 225-231, 2007
Signal integrity analysis of package and printed circuit board with multiple vias in substrate of layered dielectrics
B Wu, L Tsang
IEEE Transactions on Advanced Packaging 33 (2), 510-516, 2009
Modeling multiple vias with arbitrary shape of antipads and pads in high speed interconnect circuits
B Wu, L Tsang
IEEE microwave and wireless components letters 19 (1), 12-14, 2008
Full-wave solver for microstrip trace and through-hole via in layered media
CJ Ong, B Wu, L Tsang, X Gu
IEEE transactions on advanced packaging 31 (2), 292-302, 2008
Full-wave modeling of multiple vias using differential signaling and shared antipad in multilayered high speed vertical interconnects
B Wu, L Tsang
Progress In Electromagnetics Research 97, 129-139, 2009
Fast computation of layered medium Green's functions of multilayers and lossy media using fast all-modes method and numerical modified steepest descent path method
B Wu, L Tsang
IEEE transactions on microwave theory and techniques 56 (6), 1446-1454, 2008
Electromagnetic fields of Hertzian dipoles in layered media of moderate thickness including the effects of all modes
L Tsang, B Wu
IEEE Antennas and Wireless Propagation Letters 6, 316-319, 2007
Electromagnetic modeling of massively coupled through silicon vias for 3D interconnects
B Wu, X Gu, L Tsang, MB Ritter
Microwave and Optical Technology Letters 53 (6), 1204-1206, 2011
Methods and designs for improving the signal integrity of vertical interconnects in high performance packaging
B Wu, HL Lo
Progress In Electromagnetics Research 123, 1-11, 2012
Efficient full-wave modeling of high density TSVs for 3D integration
X Gu, B Wu, M Ritter, L Tsang
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC …, 2010
Fast all modes (FAM) method combined with NMSP for evaluating spatial domain layered medium Green's functions of moderate thickness
B Wu, L Tsang, CJ Ong
Microwave and optical technology letters 49 (12), 3112-3118, 2007
Electromagnetic fields of Hertzian dipoles in thin-layered media
L Tsang, CJ Ong, B Wu
IEEE antennas and wireless propagation letters 5, 537-540, 2006
High-density interconnect board design for wafer-level packaging
B Wu, B Brown, E Warner
Electronics letters 47 (20), 1137-1138, 2011
Micro-via structure design for high performance integrated circuits
C Ye, B Wu
US Patent 7,649,265, 2010
Fast full wave analysis of PCB via arrays with model-to-hardware correlation
X Gu, B Wu, C Baks, L Tsang
2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging …, 2009
Barbed transmission lines for crosstalk suppression
B Wu, T Mo
2012 Asia-Pacific Symposium on Electromagnetic Compatibility, 621-624, 2012
Passive equalizer design on high density interconnects for 25Gbps high speed IO and beyond
B Wu, T Mo
2014 15th International Conference on Electronic Packaging Technology, 39-42, 2014
The viability of 25 Gb/s on-board signalling
MB Ritter, P Pepeljugoski, X Gu, Y Kwark, D Kam, R Rimolo-Donadio, ...
2008 58th Electronic Components and Technology Conference, 1121-1127, 2008
Electromagnetic fields and modal excitations on a thin silver film
JQ Bagley, B Wu, L Tsang
JOSA A 26 (11), 2362-2367, 2009
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