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Praveen Kumar
Praveen Kumar
Indian Institute of Science, Bangalore, India
Verifisert e-postadresse på iisc.ac.in - Startside
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Review: overcoming the paradox of strength and ductility in ultrafine-grained materials at low temperatures
P Kumar, M Kawasaki, TG Langdon
J Mater Sci 51 (1), 7-18, 2016
1302016
Microstructural coarsening in Sn-Ag-based solders and its effects on mechanical properties
I Dutta, P Kumar, G Subbarayan
JOM Journal of the Minerals, Metals and Materials Society 61 (6), 29-38, 2009
1222009
Interfacial Effects During Thermal Cycling of Cu-Filled Through-Silicon Vias (TSV)
P Kumar, I Dutta, MS Bakir
Journal of electronic materials 41 (2), 322-335, 2012
1142012
Harper-Dorn creep
ME Kassner, P Kumar, W Blum
International journal of plasticity 23 (6), 980-1000, 2007
1022007
Mechanical characteristics of a Zn–22% Al alloy processed to very high strains by ECAP
P Kumar, C Xu, TG Langdon
Materials Science and Engineering: A 429 (1-2), 324-328, 2006
812006
Nano‐and Micro‐Mechanical Properties of Ultrafine‐Grained Materials Processed by Severe Plastic Deformation Techniques
M Kawasaki, B Ahn, P Kumar, J Jang, TG Langdon
Advanced Engineering Materials, 2017
642017
Microstructurally adaptive model for primary and secondary creep of Sn-Ag-based solders
P Kumar, Z Huang, SC Chavali, DK Chan, I Dutta, G Subbarayan, V Gupta
IEEE Transactions on Components, Packaging and Manufacturing Technology 2 (2 …, 2011
612011
The significance of grain boundary sliding in the superplastic Zn–22% Al alloy after processing by ECAP
P Kumar, C Xu, TG Langdon
Materials Science and Engineering: A 410, 447-450, 2005
562005
Fifty years of Harper–Dorn creep: a viable creep mechanism or a Californian artifact?
P Kumar, ME Kassner, TG Langdon
Journal of materials science 42 (2), 409-420, 2007
512007
Solid–state diffusion–controlled growth of the intermediate phases from room temperature to an elevated temperature in the Cu–Sn and the Ni–Sn systems
VA Baheti, S Kashyap, P Kumar, K Chattopadhyay, A Paul
Journal of Alloys and Compounds 727, 832-840, 2017
492017
Bifurcation of the Kirkendall marker plane and the role of Ni and other impurities on the growth of Kirkendall voids in the Cu–Sn system
VA Baheti, S Kashyap, P Kumar, K Chattopadhyay, A Paul
Acta Materialia 131, 260-270, 2017
492017
Interface-related reliability challenges in 3-D interconnect systems with through-silicon vias
I Dutta, P Kumar, MS Bakir
JOM Journal of the Minerals, Metals and Materials Society 63 (10), 70-77, 2011
492011
Fracture of Sn-Ag-Cu Solder Joints on Cu Substrates: I. Effects of Loading and Processing Conditions
Z Huang, P Kumar, I Dutta, JHL Pang, R Sidhu, M Renavikar, R Mahajan
Journal of Electronic Materials, 1-15, 2011
482011
Liquid Phase Sintered Solders with Indium as Minority Phase for Next Generation Thermal Interface Material Applications
I Dutta, R Raj, P Kumar, T Chen, CM Nagaraj, J Liu, M Renavikar, ...
Journal of electronic materials 38 (12), 2735-2745, 2009
482009
The contribution of grain boundary sliding in tensile deformation of an ultrafine-grained aluminum alloy having high strength and high ductility
T Mungole, P Kumar, M Kawasaki, TG Langdon
Journal of Materials Science 50 (10), 3549-3561, 2015
442015
A critical examination of the paradox of strength and ductility in ultrafine-grained metals
T Mungole, P Kumar, M Kawasaki, TG Langdon
Journal of Materials Research 29 (21), 2534-2546, 2014
422014
Recrystallization and Ag₃Sn Particle Redistribution During Thermomechanical Treatment of Bulk Sn-Ag-Cu Solder Alloys
U Sahaym, B Talebanpour, S Seekins, I Dutta, P Kumar, P Borgesen
IEEE Transactions on Components, Packaging and Manufacturing Technology 3 …, 2013
412013
Identification of whisker grain in Sn coatings by analyzing crystallographic micro-texture using electron back-scatter diffraction
P Jagtap, A Chakraborty, P Eisenlohr, P Kumar
Acta Materialia 134, 346-359, 2017
402017
Electric current induced flow of liquid metals: Mechanism and substrate-surface effects
P Kumar, J Howarth, I Dutta
Journal of Applied Physics 115, 044915, 2014
402014
Wrinkling of atomic planes in ultrathin Au nanowires
A Roy, S Kundu, K Müller, A Rosenauer, S Singh, P Pant, MP Gururajan, ...
Nano letters 14 (8), 4859-4866, 2014
392014
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Artikler 1–20