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Praveen Kumar
Praveen Kumar
Indian Institute of Science, Bangalore, India
Verifisert e-postadresse på iisc.ac.in - Startside
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Microstructural coarsening in Sn-Ag-based solders and its effects on mechanical properties
I Dutta, P Kumar, G Subbarayan
JOM Journal of the Minerals, Metals and Materials Society 61 (6), 29-38, 2009
1162009
Review: overcoming the paradox of strength and ductility in ultrafine-grained materials at low temperatures
P Kumar, M Kawasaki, TG Langdon
J Mater Sci 51 (1), 7-18, 2016
1142016
Interfacial Effects During Thermal Cycling of Cu-Filled Through-Silicon Vias (TSV)
P Kumar, I Dutta, MS Bakir
Journal of electronic materials 41 (2), 322-335, 2012
1042012
Harper-Dorn creep
ME Kassner, P Kumar, W Blum
International journal of plasticity 23 (6), 980-1000, 2007
912007
Mechanical characteristics of a Zn–22% Al alloy processed to very high strains by ECAP
P Kumar, C Xu, TG Langdon
Materials Science and Engineering: A 429 (1-2), 324-328, 2006
762006
Microstructurally adaptive model for primary and secondary creep of Sn-Ag-based solders
P Kumar, Z Huang, SC Chavali, DK Chan, I Dutta, G Subbarayan, V Gupta
IEEE Transactions on Components, Packaging and Manufacturing Technology 2 (2 …, 2011
602011
Nano‐and Micro‐Mechanical Properties of Ultrafine‐Grained Materials Processed by Severe Plastic Deformation Techniques
M Kawasaki, B Ahn, P Kumar, J Jang, TG Langdon
Advanced Engineering Materials, 2017
572017
The significance of grain boundary sliding in the superplastic Zn–22% Al alloy after processing by ECAP
P Kumar, C Xu, TG Langdon
Materials Science and Engineering: A 410, 447-450, 2005
522005
Interface-related reliability challenges in 3-D interconnect systems with through-silicon vias
I Dutta, P Kumar, MS Bakir
JOM Journal of the Minerals, Metals and Materials Society 63 (10), 70-77, 2011
492011
Fifty years of Harper–Dorn creep: a viable creep mechanism or a Californian artifact?
P Kumar, ME Kassner, TG Langdon
Journal of materials science 42 (2), 409-420, 2007
482007
Liquid Phase Sintered Solders with Indium as Minority Phase for Next Generation Thermal Interface Material Applications
I Dutta, R Raj, P Kumar, T Chen, CM Nagaraj, J Liu, M Renavikar, ...
Journal of electronic materials 38 (12), 2735-2745, 2009
472009
Fracture of Sn-Ag-Cu Solder Joints on Cu Substrates: I. Effects of Loading and Processing Conditions
Z Huang, P Kumar, I Dutta, JHL Pang, R Sidhu, M Renavikar, R Mahajan
Journal of Electronic Materials, 1-15, 2011
452011
Bifurcation of the Kirkendall marker plane and the role of Ni and other impurities on the growth of Kirkendall voids in the Cu–Sn system
VA Baheti, S Kashyap, P Kumar, K Chattopadhyay, A Paul
Acta Materialia 131, 260-270, 2017
422017
The contribution of grain boundary sliding in tensile deformation of an ultrafine-grained aluminum alloy having high strength and high ductility
T Mungole, P Kumar, M Kawasaki, TG Langdon
Journal of Materials Science 50 (10), 3549-3561, 2015
422015
A critical examination of the paradox of strength and ductility in ultrafine-grained metals
T Mungole, P Kumar, M Kawasaki, TG Langdon
Journal of Materials Research 29 (21), 2534-2546, 2014
402014
Electric current induced flow of liquid metals: Mechanism and substrate-surface effects
P Kumar, J Howarth, I Dutta
Journal of Applied Physics 115, 044915, 2014
392014
Solid–state diffusion–controlled growth of the intermediate phases from room temperature to an elevated temperature in the Cu–Sn and the Ni–Sn systems
VA Baheti, S Kashyap, P Kumar, K Chattopadhyay, A Paul
Journal of Alloys and Compounds 727, 832-840, 2017
382017
Identification of whisker grain in Sn coatings by analyzing crystallographic micro-texture using electron back-scatter diffraction
P Jagtap, A Chakraborty, P Eisenlohr, P Kumar
Acta Materialia 134, 346-359, 2017
382017
Wrinkling of atomic planes in ultrathin Au nanowires
A Roy, S Kundu, K Müller, A Rosenauer, S Singh, P Pant, MP Gururajan, ...
Nano letters 14 (8), 4859-4866, 2014
382014
Recrystallization and Ag₃Sn Particle Redistribution During Thermomechanical Treatment of Bulk Sn-Ag-Cu Solder Alloys
U Sahaym, B Talebanpour, S Seekins, I Dutta, P Kumar, P Borgesen
IEEE Transactions on Components, Packaging and Manufacturing Technology 3 …, 2013
382013
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Artikler 1–20