Guodong Meng
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Simultaneously enhanced dielectric properties and through-plane thermal conductivity of epoxy composites with alumina and boron nitride nanosheets
Z Wang, G Meng, L Wang, L Tian, S Chen, G Wu, B Kong, Y Cheng
Scientific reports 11 (1), 2495, 2021
Asymmetric alicyclic amine-polyether amine molecular chain structure for improved energy storage density of high-temperature crosslinked polymer capacitor
S Chen, G Meng, B Kong, B Xiao, Z Wang, Z Jing, Y Gao, G Wu, H Wang, ...
Chemical Engineering Journal 387, 123662, 2020
Transitions between electron emission and gas breakdown mechanisms across length and pressure scales
AL Garner, G Meng, Y Fu, AM Loveless, RS Brayfield, AM Darr
Journal of Applied Physics 128 (21), 2020
Demonstration of field emission driven microscale gas breakdown for pulsed voltages using in-situ optical imaging
G Meng, X Gao, AM Loveless, C Dong, D Zhang, K Wang, B Zhu, ...
Physics of Plasmas 25 (8), 2018
The transition to Paschen’s law for microscale gas breakdown at subatmospheric pressure
AM Loveless, G Meng, Q Ying, F Wu, K Wang, Y Cheng, AL Garner
Scientific reports 9 (1), 5669, 2019
A high-throughput assessment of the adsorption capacity and Li-ion diffusion dynamics in Mo-based ordered double-transition-metal MXenes as anode materials for fast-charging LIBs
H Wang, Z Jing, H Liu, X Feng, G Meng, K Wu, Y Cheng, B Xiao
Nanoscale 12 (48), 24510-24526, 2020
Electrical characteristics of nanometer gaps in vacuum under direct voltage
G Meng, Y Cheng, K Wu, L Chen
IEEE Transactions on Dielectrics and Electrical Insulation 21 (4), 1950-1956, 2014
Spatio-temporal dynamics of pulsed gas breakdown in microgaps
G Meng, Q Ying, AM Loveless, F Wu, K Wang, Y Fu, AL Garner, Y Cheng
Physics of Plasmas 26 (1), 2019
Nan Li
YH Cheng, B Xiao, X Gao, G Meng
International Conference on Electrical Materials and Power Equipment (ICEMPE), 2021
Influence of pulse steepness on vacuum flashover of casting epoxy resin
C Yu, C Yonghong, W Zengbin, Z Jiabin, M Guodong, W Kai, L Shengtao
Plasma Science and Technology 11 (1), 89, 2009
Thickness-tunable growth of ultra-large, continuous and high-dielectric h-BN thin films
D Zhang, F Wu, Q Ying, X Gao, N Li, K Wang, Z Yin, Y Cheng, G Meng
Journal of Materials Chemistry C 7 (7), 1871-1879, 2019
Review on the breakdown characteristics and discharge behaviors at the micro & nano scale
Y Cheng, G Meng, C Dong
Transactions of china electrotechnical society 32 (2), 13-23, 2017
Molecular dynamics simulations of thermal evaporation and critical electric field of copper nanotips
X Gao, A Kyritsakis, M Veske, W Sun, B Xiao, G Meng, Y Cheng, ...
Journal of Physics D: Applied Physics 53 (36), 365202, 2020
Experimental study on electrical breakdown for devices with micrometer gaps
G Meng, Y Cheng, C Dong, K Wu
Plasma Science and Technology 16 (12), 1083, 2014
Improvement of insulation defect identification for DC XLPE cable by considering PD aging
W Song, J Tang, C Pan, G Meng, M Zhang
International Journal of Electrical Power & Energy Systems 114, 105409, 2020
Variation of surface charge distribution in PD sequences
C Pan, K Wu, Y Meng, Y Cheng, G Meng
2012 Annual Report Conference on Electrical Insulation and Dielectric …, 2012
From atomic modification to structure engineering: layered NiCo–MnO 2 with ultrafast kinetics and optimized stress distribution for aqueous zinc ion storage
J Yin, R Zhu, L Xia, H Liu, Y Gao, Z Gan, X Feng, M Wang, G Meng, Y Su, ...
Journal of Materials Chemistry A 11 (21), 11436-11444, 2023
Transition of the dominant charge accumulation mechanism at a Gas‐solid interface under DC voltage
Y Luo, J Tang, C Pan, Z Pan, G Meng
IET Generation, Transmission & Distribution 14 (15), 3078-3088, 2020
Unlocking the Potential of Vanadium Oxide for Ultrafast and Stable Zn2+ Storage Through Optimized Stress Distribution: From Engineering Simulation to Elaborate …
Y Gao, L Xia, J Yin, Z Gan, X Feng, G Meng, Y Cheng, X Xu
Small Methods 6 (12), 2200999, 2022
In-situ optical observation of dynamic breakdown process across microgaps at atmospheric pressure
G Meng, Y Cheng, X Gao, K Wang, C Dong, B Zhu
IEEE Transactions on Dielectrics and Electrical Insulation 25 (4), 1502-1507, 2018
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Articles 1–20