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Stefano Piersanti
Stefano Piersanti
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Title
Cited by
Cited by
Year
Millimeter waves channel measurements and path loss models
S Piersanti, LA Annoni, D Cassioli
2012 IEEE International Conference on Communications (ICC), 4552-4556, 2012
1002012
Through silicon via (TSV) defect modeling, measurement, and analysis
DH Jung, Y Kim, JJ Kim, H Kim, S Choi, YH Song, HC Bae, KS Choi, ...
IEEE transactions on components, packaging and manufacturing technology 7 (1 …, 2016
572016
Near-field shielding performances of EMI noise suppression absorbers
S Piersanti, F de Paulis, A Orlandi, S Connor, Q Liu, B Archambeault, ...
IEEE Transactions on Electromagnetic Compatibility 59 (2), 654-661, 2016
522016
Transient analysis of TSV equivalent circuit considering nonlinear MOS capacitance effects
S Piersanti, F De Paulis, A Orlandi, M Swaminathan, V Ricchiuti
IEEE Transactions on Electromagnetic Compatibility 57 (5), 1216-1225, 2015
432015
Decoupling capacitors placement for a multichip PDN by a nature-inspired algorithm
S Piersanti, F de Paulis, C Olivieri, A Orlandi
IEEE Transactions on Electromagnetic Compatibility 60 (6), 1678-1685, 2017
352017
Characterization of path loss and delay spread of 60-GHz UWB channels vs. frequency
D Cassioli, LA Annoni, S Piersanti
2013 IEEE International Conference on Communications (ICC), 5153-5157, 2013
222013
Near field shielding performances of absorbing materials for integrated circuits (IC) applications part I: Lateral excitation
S Piersanti, A Orlandi, F de Paulis, S Connor, MA Khorrami, P Dixon, ...
IEEE Transactions on electromagnetic compatibility 1 (60), 188-195, 2018
202018
Notice of retraction: Genetic algorithm optimization for the total radiated power of a meandered line by using an artificial neural network
S Piersanti, A Orlandi
IEEE Transactions on Electromagnetic Compatibility 60 (4), 1014-1017, 2017
192017
Impact of frequency-dependent and nonlinear parameters on transient analysis of through silicon vias equivalent circuit
S Piersanti, F de Paulis, A Orlandi, J Fan
IEEE Transactions on Electromagnetic Compatibility 57 (3), 538-545, 2015
162015
Electromagnetic Absorbing materials design by optimization using a machine learning approach
S Piersanti, A Orlandi, F de Paulis
IEEE Transactions on Electromagnetic Compatibility, 2018
142018
Electric Dipole Equations in Very-Near-Field Conditions for Electromagnetic Shielding Assessment-Part II: Wave Impedance, Reflection, and Transmission
S Piersanti, F de Paulis, A Orlandi, SR Connor, B Archambeault, P Dixon, ...
Institute of Electrical and Electronics Engineers (IEEE) 59 (4), 1203, 2017
132017
Analytical evaluation of scattering parameters for equivalent circuit of through silicon via array
R Cecchetti, S Piersanti, F de Paulis, A Orlandi, J Fan
Electronics Letters 51 (13), 1025-1027, 2015
132015
Through-silicon via capacitance–voltage hysteresis modeling for 2.5-D and 3-D IC
DH Kim, Y Kim, J Cho, B Bae, J Park, H Lee, J Lim, JJ Kim, S Piersanti, ...
IEEE Transactions on Components, Packaging and Manufacturing Technology 7 (6 …, 2017
102017
Algorithm for extracting parameters of the coupling capacitance hysteresis cycle for TSV transient modeling and robustness analysis
S Piersanti, E Pellegrino, F De Paulis, A Orlandi, DH Jung, DH Kim, J Kim, ...
IEEE Transactions on Electromagnetic Compatibility 59 (4), 1329-1338, 2016
102016
Through silicon via time domain crosstalk modeling considering hysteretic coupling capacitance
S Piersanti, F De Paulis, A Orlandi, DH Kim, J Cho, J Kim
2015 IEEE International Symposium on Electromagnetic Compatibility (EMC …, 2015
102015
Equivalent circuit modeling of dielectric hysteresis loops in through silicon vias
S Piersanti, F De Paulis, A Orlandi, DH Kim, J Kim, J Fan
IEEE Transactions on Electromagnetic Compatibility 57 (6), 1510-1516, 2015
92015
Efficient iterative process based on an improved genetic algorithm for decoupling capacitor placement at board level
F de Paulis, R Cecchetti, C Olivieri, S Piersanti, A Orlandi, M Buecker
Electronics 8 (11), 1219, 2019
82019
TEM-like launch geometries and simplified de-embedding for accurate through silicon via characterization
F de Paulis, S Piersanti, Q Wang, J Cho, N Erickson, B Achkir, J Fan, ...
IEEE Transactions on Instrumentation and Measurement 66 (4), 792-801, 2017
82017
Decoupling capacitors placement at board level adopting a nature-inspired algorithm
S Piersanti, R Cecchetti, C Olivieri, F de Paulis, A Orlandi, M Buecker
Electronics 8 (7), 737, 2019
72019
Impact of chip and interposer PDN to eye diagram in high speed channels
F De Paulis, B Zhao, S Piersanti, J Cho, R Cecchetti, B Achkir, A Orlandi, ...
2018 IEEE 22nd Workshop on Signal and Power Integrity (SPI), 1-4, 2018
72018
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