| Secure and reliable XOR arbiter PUF design: An experimental study based on 1 trillion challenge response pair measurements C Zhou, KK Parhi, CH Kim Proceedings of the 54th Annual Design Automation Conference 2017, 1-6, 2017 | 77 | 2017 |
| A data remanence based approach to generate 100% stable keys from an SRAM physical unclonable function M Liu, C Zhou, Q Tang, KK Parhi, CH Kim 2017 IEEE/ACM International Symposium on Low Power Electronics and Design …, 2017 | 35 | 2017 |
| A DRAM based physical unclonable function capable of generating >1032 Challenge Response Pairs per 1Kbit array for secure chip authentication Q Tang, C Zhou, W Choi, G Kang, J Park, KK Parhi, CH Kim 2017 IEEE Custom Integrated Circuits Conference (CICC), 1-4, 2017 | 27 | 2017 |
| Estimating delay differences of arbiter PUFs using silicon data SVS Avvaru, C Zhou, S Satapathy, Y Lao, CH Kim, KK Parhi 2016 Design, Automation & Test in Europe Conference & Exhibition (DATE), 543-546, 2016 | 25 | 2016 |
| Soft response generation and thresholding strategies for linear and feed-forward MUX PUFs C Zhou, S Satapathy, Y Lao, KK Parhi, CH Kim Proceedings of the 2016 International Symposium on Low Power Electronics and …, 2016 | 24 | 2016 |
| Electromigration effects in power grids characterized from a 65 nm test chip C Zhou, R Fung, SJ Wen, R Wong, CH Kim IEEE Transactions on Device and Materials Reliability 20 (1), 74-83, 2019 | 13 | 2019 |
| Estimation of instantaneous frequency fluctuation in a fast DVFS environment using an empirical BTI stress-relaxation model C Zhou, X Wang, W Xu, Y Zhu, VJ Reddi, CH Kim 2014 IEEE International Reliability Physics Symposium, 2D. 2.1-2D. 2.6, 2014 | 13 | 2014 |
| Characterizing electromigration effects in a 16nm FinFET process using a circuit based test vehicle N Pande, C Zhou, MH Lin, R Fung, R Wong, S Wen, CH Kim 2019 IEEE International Electron Devices Meeting (IEDM), 5.3. 1-5.3. 4, 2019 | 10 | 2019 |
| A circuit-based approach for characterizing high frequency electromigration effects C Zhou, X Wang, R Fung, SJ Wen, R Wong, CH Kim IEEE Transactions on Device and Materials Reliability 17 (4), 763-772, 2017 | 10 | 2017 |
| Predicting hard and soft-responses and identifying stable challenges of MUX PUFs using ANNs SVS Avvaru, C Zhou, CH Kim, KK Parhi 2017 IEEE 60th International Midwest Symposium on Circuits and Systems …, 2017 | 10 | 2017 |
| Effect of aging on linear and nonlinear MUX PUFs by statistical modeling A Koyily, SVS Avvaru, C Zhou, CH Kim, KK Parhi 2018 23rd Asia and South Pacific Design Automation Conference (ASP-DAC), 76-83, 2018 | 9 | 2018 |
| Electromigration effects in power grids characterized using an on-chip test structure with poly heaters and voltage tapping points C Zhou, R Wong, SJ Wen, CH Kim 2018 IEEE Symposium on VLSI Technology, 19-20, 2018 | 6 | 2018 |
| Effect of HCI degradation on the variability of MOSFETS C Zhou, KA Jenkins, PI Chuang, C Vezyrtzis 2018 IEEE International Reliability Physics Symposium (IRPS), P-RT. 1-1-P-RT …, 2018 | 6 | 2018 |
| An entropy test for determining whether a MUX PUF is linear or nonlinear A Koyily, C Zhou, CH Kim, KK Parhi 2017 IEEE International Symposium on Circuits and Systems (ISCAS), 1-4, 2017 | 6 | 2017 |
| High frequency AC electromigration lifetime measurements from a 32nm test chip C Zhou, X Wang, R Fung, SJ Wen, R Wong, CH Kim 2015 Symposium on VLSI Technology (VLSI Technology), T42-T43, 2015 | 6 | 2015 |
| Predicting soft-response of mux pufs via logistic regression of total delay difference A Koyily, C Zhou, CH Kim, KK Parhi 2018 IEEE International Symposium on Circuits and Systems (ISCAS), 1-5, 2018 | 5 | 2018 |
| Electromigration-induced bit-error-rate degradation of interconnect signal paths characterized from a 16nm test chip N Pande, C Zhou, MH Lin, R Fung, R Wong, S Wen, CH Kim 2021 Symposium on VLSI Technology, 1-2, 2021 | 3 | 2021 |
| A 16nm All-digital Hardware Monitor for Evaluating Electromigration effects in Signal Interconnects through Bit-Error-Rate Tracking N Pande, C Zhou, MH Lin, R Fung, R Wong, SJ Wen, CH Kim IEEE Transactions on Device and Materials Reliability 22 (2), 194-204, 2022 | 2 | 2022 |
| Studying the Impact of Temperature Gradient on Electromigration Lifetime Using a Power Grid Test Structure with On-Chip Heaters YH Yi, C Kim, C Zhou, A Kteyan, V Sukharev 2023 IEEE International Reliability Physics Symposium (IRPS), 1-5, 2023 | | 2023 |
| Stable memory cell identification for hardware security M Liu, C Zhou, KK Parhi, H Kim US Patent App. 17/691,618, 2022 | | 2022 |
Chris H. KimUniversity of MinnesotaVerified email at umn.edu
