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Sriram KrishnamoorthyUniversity of California, Santa BarbaraVerified email at ucsb.edu
Praneeth RangaUniversity of UtahVerified email at utah.edu
Saurav RoyPhD student, University of California, Santa BarbaraVerified email at ucsb.edu
Michael A. (Mike) ScarpullaAssociate Professor, MSE & ECE, University of UtahVerified email at utah.edu
Carl PetersonGraduate Student, University of California Santa BarbaraVerified email at ucsb.edu
Rujun SunSchool of Microelectronics, Xidian UniversityVerified email at xidian.edu.cn
Muad SalehSr. Product Engineer, Lam ResearchVerified email at wsu.edu
Joel B VarleyLawrence Livermore National LaboratoryVerified email at llnl.gov
K. G. LynnWashington State UniversityVerified email at wsu.edu
Jacob H. LeachKyma TechnologiesVerified email at kymatech.com
Jani JesenovecPrincipal Scientist, BAE SystemsVerified email at baesystems.com
Yiwen SongDepartment of Mechanical Engineering, The Pennsylvania State UniversityVerified email at psu.edu
Sukwon ChoiAssociate Professor of Mechanical Engineering, The Pennsylvania State UniversityVerified email at psu.edu
Daniel P. ShoemakerAssociate Professor, University of IllinoisVerified email at illinois.edu
Adrian ChmielewskiCEMES - CNRSVerified email at cemes.fr
Nasim AlemPennsylvania State UniversityVerified email at psu.edu
Daniel FeezellUniversity of New MexicoVerified email at unm.edu
Ashwin RishinaramangalamIntel CorporationVerified email at intel.com
Berardi Sensale RodriguezThe University of UtahVerified email at alumni.nd.edu
Fikadu AlemaAgnitron Technology, Inc.Verified email at agnitron.com