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Co-authors
Rui YangInterDigitalVerified email at interdigital.com
I-Tai LuDepartment of Electrical and Computer Engineering, Tandon School of Engineering, New York UniversityVerified email at nyu.edu
Lochan VermaAppleVerified email at apple.com
Alfred AsterjadhiQualcomm Technologies, IncVerified email at qualcomm.com
Rahul TandraVMWareVerified email at vmware.com
Onur SahinApple Inc.Verified email at apple.com
Vincent Knowles Jones IVQualcomm IncVerified email at qti.qualcomm.com
Abhishek PatilQualcomm ResearchVerified email at ieee.org
Sanjay GoyalNokiaVerified email at nyu.edu
Pei LiuNew York UniversityVerified email at nyu.edu
Shivendra S PanwarProfessor of Electrical and Computer Engineering, Tandon School of Engineering, New York UniversityVerified email at nyu.edu
Juan FangWireless Research Scientist, Intel LabsVerified email at intel.com
Simone MerlinQualcommVerified email at qti.qualcomm.com
Ahmed R. ElsherifQualcomm, Inc.Verified email at ucdavis.edu
Louay JalloulQualcomm Inc.Verified email at ieee.org