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Michael Theurer
Michael Theurer
Research Associate, Fraunhofer HHI, Berlin, Germany
Verified email at hhi.fraunhofer.de
Title
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Cited by
Year
Photonic-integrated circuit for continuous-wave THz generation
M Theurer, T Göbel, D Stanze, U Troppenz, F Soares, N Grote, M Schell
Optics Letters 38 (19), 3724-3726, 2013
292013
56 Gb/s L‐band InGaAlAs ridge waveguide electroabsorption modulated laser with integrated SOA
M Theurer, G Przyrembel, A Sigmund, WD Molzow, U Troppenz, M Möhrle
physica status solidi (a) 213 (4), 970-974, 2016
232016
Flip-chip integration of InP and SiN
M Theurer, M Moehrle, A Sigmund, KO Velthaus, RM Oldenbeuving, ...
IEEE Photonics Technology Letters 31 (3), 273-276, 2019
222019
Flip-chip integration of InP to SiN photonic integrated circuits
M Theurer, M Moehrle, A Sigmund, KO Velthaus, RM Oldenbeuving, ...
Journal of Lightwave Technology 38 (9), 2630-2636, 2020
202020
2× 56 GB/s from a double side electroabsorption modulated DFB laser and application in novel optical PAM4 generation
M Theurer, H Zhang, Y Wang, W Chen, L Chen, U Troppenz, ...
Journal of lightwave technology 35 (4), 706-710, 2016
202016
4× 56 Gb/s high output power electroabsorption modulated laser array with up to 7 km fiber transmission in L-band
M Theurer, M Moehrle, U Troppenz, HG Bach, A Sigmund, G Przyrembel, ...
Journal of Lightwave Technology 36 (2), 181-186, 2018
192018
Integrated transmitter devices on InP exploiting electro-absorption modulation
M Baier, N Grote, M Moehrle, A Sigmund, FM Soares, M Theurer, ...
PhotoniX 1 (1), 4, 2020
142020
2× 56 GB/s from a double side electroabsorption modulated DFB laser
M Theurer, Y Wang, L Zeng, U Troppenz, G Przyrembel, A Sigmund, ...
Optical Fiber Communication Conference, Tu3D. 6, 2016
142016
3D-printed optical probes for wafer-level testing of photonic integrated circuits
M Trappen, M Blaicher, PI Dietrich, C Dankwart, Y Xu, T Hoose, MR Billah, ...
Optics Express 28 (25), 37996-38007, 2020
92020
Hybrid integrated silicon nitride lasers
JP Epping, A Leinse, RM Oldenbeuving, I Visscher, D Geuzebroek, ...
Physics and Simulation of Optoelectronic Devices XXVIII 11274, 203-212, 2020
62020
Actively aligned flip-chip integration of InP to SiN utilizing optical backscatter reflectometry
M Theurer, M Moehrle, A Sigmund, KO Velthaus, RM Oldenbeuving, ...
45th European Conference on Optical Communication (ECOC 2019), 1-4, 2019
62019
Ultra-low power SiGe driver-IC for high-speed electroabsorption modulated DFB lasers
JH Choi, M Gruner, HG Bach, M Theurer, U Troppenz, M Möhrle, M Schell
Optical Fiber Communication Conference, Th3G. 3, 2017
52017
Transmitter PIC for THz applications based on generic integration technology
FM Soares, J Kreissl, M Theurer, E Bitincka, T Goebel, M Moehrle, ...
2013 International Conference on Indium Phosphide and Related Materials …, 2013
52013
4× 56 Gb/s high output power electroabsorption modulated laser array
M Theurer, M Moehrle, U Troppenz, HG Bach, A Sigmund, G Przyrembel, ...
2017 Optical Fiber Communications Conference and Exhibition (OFC), 1-3, 2017
42017
Uncooled 100 GBd O-Band EML for Datacom Transmitter Arrays
U Troppenz, M Theurer, M Moehrle, A Sigmund, M Gruner, M Schell
2022 Optical Fiber Communications Conference and Exhibition (OFC), 1-3, 2022
2022
Hybrid photonic integration for communication, sensing and quantum technology
M Schell, N Keil, M Kleinert, D de Felipe, C Zawadzki, M Weigel, M Kresse, ...
Integrated Optics: Devices, Materials, and Technologies XXVI, PC1200407, 2022
2022
Electroabsorption modulated lasers and hybridly integrated lasers for communication and sensing
MAD Theurer
PQDT-Global, 2021
2021
Semiconductor light source and method for manufacturing a semiconductor light source
M Möhrle, M Theurer, A Sigmund, U Troppenz
US Patent 10,855,051, 2020
2020
3D-printed optical probes for wafer-level testing of photonic integrated circuits
MR BILLAH, A ABBASI, R BAETS, UTE TROPPENZ, M THEURER, ...
2020
Electroabsorption Modulated Lasers and Hybridly Integrated Lasers for Communication and Sensing
MAD Theurer
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