| Flip-chip integration of InP to SiN photonic integrated circuits M Theurer, M Moehrle, A Sigmund, KO Velthaus, RM Oldenbeuving, ... Journal of Lightwave Technology 38 (9), 2630-2636, 2020 | 51 | 2020 |
| Flip-chip integration of InP and SiN M Theurer, M Moehrle, A Sigmund, KO Velthaus, RM Oldenbeuving, ... IEEE Photonics Technology Letters 31 (3), 273-276, 2019 | 32 | 2019 |
| Photonic-integrated circuit for continuous-wave THz generation M Theurer, T Göbel, D Stanze, U Troppenz, F Soares, N Grote, M Schell Optics Letters 38 (19), 3724-3726, 2013 | 31 | 2013 |
| 4× 56 Gb/s high output power electroabsorption modulated laser array with up to 7 km fiber transmission in L-band M Theurer, M Moehrle, U Troppenz, HG Bach, A Sigmund, G Przyrembel, ... Journal of Lightwave Technology 36 (2), 181-186, 2018 | 26 | 2018 |
| 2× 56 GB/s from a double side electroabsorption modulated DFB laser and application in novel optical PAM4 generation M Theurer, H Zhang, Y Wang, W Chen, L Chen, U Troppenz, ... Journal of lightwave technology 35 (4), 706-710, 2016 | 25 | 2016 |
| 3D-printed optical probes for wafer-level testing of photonic integrated circuits M Trappen, M Blaicher, PI Dietrich, C Dankwart, Y Xu, T Hoose, MR Billah, ... Optics Express 28 (25), 37996-38007, 2020 | 24 | 2020 |
| 56 Gb/s L‐band InGaAlAs ridge waveguide electroabsorption modulated laser with integrated SOA M Theurer, G Przyrembel, A Sigmund, WD Molzow, U Troppenz, M Möhrle physica status solidi (a) 213 (4), 970-974, 2016 | 22 | 2016 |
| Integrated transmitter devices on InP exploiting electro-absorption modulation M Baier, N Grote, M Moehrle, A Sigmund, FM Soares, M Theurer, ... PhotoniX 1 (1), 4, 2020 | 17 | 2020 |
| 2× 56 GB/s from a double side electroabsorption modulated DFB laser M Theurer, Y Wang, L Zeng, U Troppenz, G Przyrembel, A Sigmund, ... Optical Fiber Communication Conference, Tu3D. 6, 2016 | 14 | 2016 |
| Hybrid integrated silicon nitride lasers JP Epping, A Leinse, RM Oldenbeuving, I Visscher, D Geuzebroek, ... Physics and Simulation of Optoelectronic Devices XXVIII 11274, 203-212, 2020 | 12 | 2020 |
| Semiconductor light source and method for fabricating a semiconductor light source M Möhrle, M Theurer, A Sigmund, U Troppenz | 9 | 2019 |
| 200 Gb/s uncooled EML with single MQW layer stack design M Theurer, C Kottke, R Freund, F Ganzer, P Runge, M Möhrle, ... European Conference and Exhibition on Optical Communication, Th1E. 5, 2022 | 7 | 2022 |
| Uncooled 100 Gbd O-band EML for Datacom transmitter arrays U Troppenz, M Theurer, M Moehrle, A Sigmund, M Gruner, M Schell 2022 Optical Fiber Communications Conference and Exhibition (OFC), 1-3, 2022 | 7 | 2022 |
| Ultra-low-power SiGe Driver-IC for High-speed electro-absorption modulated DFB Lasers JH Choi Datacenter connectivity technologies, 659-680, 2022 | 6 | 2022 |
| Actively aligned flip-chip integration of InP to SiN utilizing optical backscatter reflectometry M Theurer, M Moehrle, A Sigmund, KO Velthaus, RM Oldenbeuving, ... 45th European Conference on Optical Communication (ECOC 2019), 1-4, 2019 | 5 | 2019 |
| Transmitter PIC for THz applications based on generic integration technology FM Soares, J Kreissl, M Theurer, E Bitincka, T Goebel, M Moehrle, ... 2013 International Conference on Indium Phosphide and Related Materials …, 2013 | 5 | 2013 |
| 4× 56 Gb/s high output power electroabsorption modulated laser array M Theurer, M Moehrle, U Troppenz, HG Bach, A Sigmund, G Przyrembel, ... 2017 Optical Fiber Communications Conference and Exhibition (OFC), 1-3, 2017 | 3 | 2017 |
| 4 x 200 Gb/s EML-Array with a Single MQW Layer Stack M Theurer, C Kottke, R Freund, F Ganzer, P Runge, M Moehrle, ... 2023 Optical Fiber Communications Conference and Exhibition (OFC), 1-4, 2023 | 2 | 2023 |
| Electroabsorption modulated lasers and hybridly integrated lasers for communication and sensing MAD Theurer PQDT-Global, 2021 | 2 | 2021 |
| Hybrid photonic integration for communication, sensing and quantum technology M Schell, N Keil, M Kleinert, D de Felipe, C Zawadzki, M Weigel, M Kresse, ... Integrated Optics: Devices, Materials, and Technologies XXVI, PC1200407, 2022 | 1 | 2022 |
