| Progress review of electromagnetic compatibility analysis technologies for packages, printed circuit boards, and novel interconnects EP Li, XC Wei, AC Cangellaris, EX Liu, YJ Zhang, M D'amore, J Kim, ... IEEE Transactions on Electromagnetic Compatibility 52 (2), 248-265, 2010 | 148 | 2010 |
| A coupled efficient and systematic full-wave time-domain macromodeling and circuit simulation method for signal integrity analysis of high-speed interconnects EP Li, EX Liu, LW Li, MS Leong IEEE Transactions on Advanced packaging 27 (1), 213-223, 2004 | 105 | 2004 |
| Compact wideband equivalent-circuit model for electrical modeling of through-silicon via EX Liu, EP Li, WB Ewe, HM Lee, TG Lim, S Gao IEEE transactions on microwave theory and techniques 59 (6), 1454-1460, 2011 | 76 | 2011 |
| Efficient modeling of rerouted return currents in multilayered power-ground planes by using integral equation XC Wei, EP Li, EX Liu, X Cui IEEE transactions on electromagnetic compatibility 50 (3), 740-743, 2008 | 52 | 2008 |
| Efficient simulation of power distribution network by using integral-equation and modal-decoupling technology XC Wei, EP Li, EX Liu, R Vahldieck IEEE transactions on microwave theory and techniques 56 (10), 2277-2285, 2008 | 51 | 2008 |
| A semi-analytical approach for system-level electrical modeling of electronic packages with large number of vias ZZ Oo, EX Liu, EP Li, X Wei, Y Zhang, M Tan, LWJ Li, R Vahldieck IEEE transactions on advanced packaging 31 (2), 267-274, 2008 | 50 | 2008 |
| An effective and efficient approach for radiated emission prediction based on amplitude-only near-field measurements WJ Zhao, BF Wang, EX Liu, HB Park, HH Park, E Song, EP Li IEEE transactions on electromagnetic compatibility 54 (5), 1186-1189, 2012 | 43 | 2012 |
| Novel methods for modeling of multiple vias in multilayered parallel-plate structures EX Liu, EP Li, ZZ Oo, X Wei, Y Zhang, R Vahldieck IEEE transactions on microwave theory and techniques 57 (7), 1724-1733, 2009 | 40 | 2009 |
| Systematic microwave network analysis for multilayer printed circuit boards with vias and decoupling capacitors YJ Zhang, ZZ Oo, XC Wei, EX Liu, J Fan, EP Li IEEE Transactions on Electromagnetic Compatibility 52 (2), 401-409, 2010 | 32 | 2010 |
| Interconnect design and analysis for through silicon interposers (TSIs) JR Cubillo, R Weerasekera, ZZ Oo, EX Liu, B Conn, S Bhattacharya, ... 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE …, 2011 | 29 | 2011 |
| Finite-difference time-domain macromodel for simulation of electromagnetic interference at high-speed interconnects EX Liu, EP Li, LW Li, Z Shen IEEE transactions on magnetics 41 (1), 65-71, 2005 | 28 | 2005 |
| An iterative approach for EMI source reconstruction based on phaseless and single-plane near-field scanning YF Shu, XC Wei, R Yang, EX Liu IEEE Transactions on Electromagnetic Compatibility 60 (4), 937-944, 2017 | 26 | 2017 |
| Emission and susceptibility modeling of finite-size power-ground planes using a hybrid integral equation method XC Wei, EP Li, EX Liu, EK Chua, ZZ Oo, R Vahldieck IEEE transactions on advanced packaging 31 (3), 536-543, 2008 | 26 | 2008 |
| Cascaded microwave network approach for power and signal integrity analysis of multilayer electronic packages ZZ Oo, EX Liu, XC Wei, Y Zhang, EP Li IEEE Transactions on Components, Packaging and Manufacturing Technology 1 (9 …, 2011 | 22 | 2011 |
| Hybridization of the scattering matrix method and modal decomposition for analysis of signal traces in a power distribution network ZZ Oo, EP Li, XC Wei, EX Liu, YJ Zhang, LWJ Li IEEE transactions on electromagnetic compatibility 51 (3), 784-791, 2009 | 18 | 2009 |
| 3D traffic noise mapping using unstructured surface mesh representation of buildings and roads WJ Zhao, EX Liu, HJ Poh, B Wang, SP Gao, CE Png, KW Li, SH Chong Applied Acoustics 127, 297-304, 2017 | 16 | 2017 |
| Two-dimensional discontinuous Galerkin time-domain method for modeling of arbitrarily shaped power-ground planes HM Lee, S Gao, EX Liu, GS Samudra, EP Li IEEE Transactions on Electromagnetic Compatibility 57 (6), 1744-1747, 2015 | 16 | 2015 |
| Analysis of multilayer planar circuits by a hybrid method EX Liu, EP Li, LW Li IEEE microwave and wireless components letters 16 (2), 66-68, 2006 | 15 | 2006 |
| Modeling of advanced multilayered packages with multiple vias and finite ground planes EX Liu, X Wei, ZZ Oo, EP Li, LW Li 2007 IEEE Electrical Performance of Electronic Packaging, 275-278, 2007 | 14 | 2007 |
| Differential evolutionary optimization of an equivalent dipole model for electromagnetic emission analysis WJ Zhao, EX Liu, B Wang, SP Gao, CE Png IEEE Transactions on Electromagnetic Compatibility 60 (6), 1635-1639, 2018 | 11 | 2018 |
