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Lih-Tyng Hwang
Lih-Tyng Hwang
Verifisert e-postadresse på mail.nsysu.edu.tw - Startside
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High performance integrated circuit chip package
I Turlik, A Reisman, D Nayak, LT Hwang, G Dishon, SL Jacobs, ...
US Patent 5,325,265, 1994
1741994
Bonding structure for an electronic device
LT Hwang, WH Lytle
US Patent 5,912,510, 1999
661999
Process for electrically connecting electrical devices using a conductive anisotropic material
T Fang, LT Hwang, WM Williams
US Patent 5,661,042, 1997
631997
Apparatus for mounting a semiconductor chip and making electrical connections thereto
A Reisman, CM Osburn, LT Hwang, J Narayan
US Patent 4,774,630, 1988
581988
Thermal stress analysis of a multichip package design
R Darveaux, I Turlik, LT Hwang, A Reisman
IEEE transactions on components, hybrids, and manufacturing technology 12 (4 …, 1989
541989
A review of the skin effect as applied to thin film interconnections
LT Hwang, I Turlik
IEEE Transactions on Components Hybrids and Manufacturing Technology 15 (1 …, 1992
531992
A thermal module design for advanced packaging
LT Hwang, I Turlik, A Reisman
Journal of electronic materials 16 (5), 347-355, 1987
491987
A high-performance thermal module for computer packaging
D Nayak, LT Hwang, I Turlik, A Reisman
Journal of electronic materials 16 (5), 357-364, 1987
421987
Passivation schemes for copper/polymer thin-film interconnections used in multichip modules
GM Adema, LT Hwang, GA Rinne, I Turlik
IEEE transactions on components, hybrids, and manufacturing technology 16 (1 …, 1993
411993
Passivation Schemes for Copper/Polymer Thin Film Interconnections Used in Multichip Modules
GM Adema, LT Hwang, GA Rinne, I Turlik
Electronic Components and Technology Conference, 776-782, 1992
411992
Parameterized models for a RF chip-to-substrate interconnect
I Doerr, LT Hwang, G Sommer, H Oppermann, L Li, M Petras, S Korf, ...
2001 Proceedings. 51st Electronic Components and Technology Conference (Cat …, 2001
392001
MIMO antenna design with built‐in decoupling mechanism for WLAN dual‐band applications
SM Wang, LT Hwang, CJ Lee, CY Hsu, FS Chang
Electronics Letters 51 (13), 966-968, 2015
292015
A ZigBee position technique for indoor localization based on proximity learning
CW Ou, CJ Chao, FS Chang, SM Wang, GX Liu, MR Wu, KY Cho, ...
2017 IEEE International Conference on Mechatronics and Automation (ICMA …, 2017
272017
Embedded multilayer printed circuit
LT Hwang, RB Lempkowski, L Li
US Patent 7,136,274, 2006
272006
Effects of polymer/metal interaction in thin-film multichip module applications
GM Adema, I Turlick, LT Hwang, GA Rinne, MJ Berry
IEEE Transactions on Components, Hybrids, and Manufacturing Technology 13 (4 …, 1990
271990
Simulation and design of lossy transmission lines in a thin-film multichip package
D Nayak, LT Hwang, I Turlik
IEEE Transactions on Components, Hybrids, and Manufacturing Technology 13 (2 …, 1990
261990
Embedded passives in organic substrate for bluetooth transceiver module
L Li, P Bowles, LT Hwang, S Plager
53rd Electronic Components and Technology Conference, 2003. Proceedings …, 2003
242003
Transmitarray design with enhanced aperture efficiency using small frequency selective surface cells and discrete Jones matrix analysis
CY Hsu, LT Hwang, TS Horng, SM Wang, FS Chang, CN Dorny
IEEE Transactions on Antennas and Propagation 66 (8), 3983-3994, 2018
232018
Detection of vital signs for multiple subjects by using self-injection-locked radar and mutually injection-locked beam scanning array
CY Hsu, CY Chuang, FK Wang, TS Horng, LT Hwang
2017 IEEE MTT-S International Microwave Symposium (IMS), 991-994, 2017
232017
Calculation of electrical parameters of a thin-film multichip package
D Nayak, LT Hwang, I Turlik
IEEE transactions on components, hybrids, and manufacturing technology 12 (2 …, 1989
231989
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