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Shaowu Huang
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Backscattering coefficients, coherent reflectivities, and emissivities of randomly rough soil surfaces at L-band for SMAP applications based on numerical solutions of Maxwell …
S Huang, L Tsang, EG Njoku, KS Chan
IEEE Transactions on Geoscience and Remote Sensing 48 (6), 2557-2568, 2010
1272010
Soil Moisture Retrieval Using Time-Series Radar Observations Over Bare Surfaces
SB Kim, L Tsang, JT Johnson, S Huang, JJ van Zyl, EG Njoku
IEEE Transactions on Geoscience and Remote Sensing 50 (5), 1853-1863, 2012
1262012
Structure comprising at least a first element bonded to a carrier having a closed metallic channel waveguide formed therein
S Huang, JA Delacruz, B Haba
US Patent 10,276,909, 2019
972019
Bonded structures with integrated passive component
B Haba, I Mohammed, R Katkar, GZ Guevara, JA Delacruz, S Huang, ...
US Patent 11,626,363, 2023
962023
Interface structures and methods for forming same
S Huang, J Delacruz
US Patent 10,446,487, 2019
952019
Electromagnetic Computation in Scattering of Electromagnetic Waves by Random Rough Surface and Dense Media in Microwave Remote Sensing of Land Surfaces
L Tsang, KH Ding, S Huang, X Xu
Proceedings of the IEEE 101 (2), 255-279, 2012
922012
Bonded structures with integrated passive component
JA Delacruz, S Huang, LW Mirkarimi
US Patent App. 15/426,942, 2018
912018
Electromagnetic Scattering of Randomly Rough Soil Surfaces Based on Numerical Solutions of Maxwell Equations in Three-Dimensional Simulations Using a Hybrid UV/PBTG/SMCG Method
S Huang, L Tsang
IEEE Transactions on Geoscience and Remote Sensing 50 (10), 4025-4035, 2012
892012
Interface structures and methods for forming same
S Huang, B Haba, JA Delacruz
US Patent 10,784,191, 2020
872020
Cavity packages
S Huang, JA Delacruz, L Wang, R Katkar, B Haba
US Patent 10,923,408, 2021
862021
Seal for microelectronic assembly
R Katkar, L Wang, CE Uzoh, S Huang, G Gao, I Mohammed
US Patent 10,508,030, 2019
782019
Integrated optical waveguides, direct-bonded waveguide interface joints, optical routing and interconnects
S Huang, JA Delacruz, L Wang, G Gao
US Patent 11,169,326, 2021
742021
Bond enhancement structure in microelectronics for trapping contaminants during direct-bonding processes
G Gao, JA Delacruz, S Huang, L Wang, GG Fountain Jr, R Katkar, ...
US Patent 11,296,044, 2022
522022
Dielets on flexible and stretchable packaging for microelectronics
S Huang, JA Delacruz
US Patent 11,355,443, 2022
432022
Thermal and electrical performance of direct bond interconnect technology for 2.5 D and 3D integrated circuits
A Agrawal, S Huang, G Gao, L Wang, J DeLaCruz, L Mirkarimi
2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 989-998, 2017
382017
Broadband Green's function with low wavenumber extraction for arbitrary shaped waveguide and applications to modeling of vias in finite power/ground plane
L Tsang, S Huang
Progress In Electromagnetics Research 152, 105-125, 2015
382015
Copolarized and cross-polarized backscattering from random rough soil surfaces from L-band to Ku-band using numerical solutions of Maxwell's equations with near-field precondition
TH Liao, L Tsang, S Huang, N Niamsuwan, S Jaruwatanadilok, S Kim, ...
IEEE Transactions on Geoscience and Remote Sensing 54 (2), 651-662, 2015
352015
Direct-bonded native interconnects and active base die
JA Delacruz, SL Teig, S Huang, WC Plants, DE Fisch
US Patent 10,522,352, 2019
312019
Subwavelength imaging enhancement through a three-dimensional plasmon superlens with rough surface
S Huang, H Wang, KH Ding, L Tsang
Optics Letters 37 (8), 1295-1297, 2012
302012
Active and passive vegetated surface models with rough surface boundary conditions from NMM3D
L Tsang, IS Koh, TH Liao, S Huang, X Xu, EG Njoku, YH Kerr
IEEE Journal of Selected Topics in Applied Earth Observations and Remote …, 2013
282013
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