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Amanpreet Kaur
Amanpreet Kaur
Assistant Professor-Oakland University
Verifisert e-postadresse på oakland.edu
Tittel
Sitert av
Sitert av
År
Selective Fabrication of SiC/Si Diodes by Excimer Laser under Ambient Conditions
A Kaur, P Chahal, T Hogan
Electronic Device Letters 37 (2), 142-145, 2016
982016
Affordable 3D printed microwave antennas
MIMG Ghazali, E Gutierrez, JC Myers, A Kaur, B Wright, P Chahal
Electronic Components and Technology Conference (ECTC), 2015 IEEE 65th, 240-246, 2015
582015
3-D Printed Air Substrates for the Design and Fabrication of RF Components
PC Mohd Ifwat Mohd Ghazali,Saranraj Karuppuswami,Amanpreet Kaur
IEEE Transactions on Components, Packaging and Manufacturing Technology, 1-8, 2017
57*2017
A Hybrid Magnetoelastic Wireless Sensor for Detection of Food Adulteration
PC Saranraj Karuppuswami , Amanpreet Kaur , Harikrishnan Arangali
IEEE Sensors Journal, 2017
37*2017
Affordable terahertz components using 3D printing
A Kaur, JC Myers, MIM Ghazali, J Byford, P Chahal
Electronic Components and Technology Conference (ECTC), 2015 IEEE 65th, 2071 …, 2015
352015
Embedded Actives Using Additive Manufacturing For High Density RF Circuits and Systems
PC Mohd Ifwat Mohd Ghazali, Saranraj Karuppuswami, Saikat Mondal, Amanpreet Kaur
IEEE Transactions on Components, Packaging and Manufacturing Technology, 2019
302019
CNTs and Graphene-Based Diodes for Microwave and Millimeter-Wave Circuits on Flexible Substrates
A Kaur, X Yang, P Chahal
IEEE Transactions on Components, Packaging and Manufacturing Technology, 2016
292016
Aerosol-Jet Printed Quasi-Optical Terahertz Filters
PC Christopher Oakley, Amanpreet Kaur, Jennifer A Byford
Electronic Components and Technology Conference (ECTC), 2017 IEEE 67th 2017 …, 2017
19*2017
3D Printed Out-of-Plane Antennas for Use on High Density Boards
PC Mohd Ifwat Mohd Ghazali, Jennifer A Byford, Saranraj Karuppuswami ...
Electronic Components and Technology Conference (ECTC), 2017 IEEE 67th, 1835 …, 2017
17*2017
RFID Compatible Sensor Tags for Remote Liquid Sample Interrogation
PC Saranraj Karuppuswami, Amanpreet Kaur, Mohd Ifwat Mohd Ghazali
Electronic Components and Technology Conference (ECTC), 2016 IEEE 66th, 2016
16*2016
Study of microwave circuits based on Metal-Insulator-Metal (MIM) diodes on flex substrates
A Kaur, X Yang, P Chahal
Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th, 2168 …, 2014
162014
3D Printed high functional density packaging compatible out-of-plane antennas
PC Mohd Ifwat Mohd Ghazali, Saranraj Karuppuswami, Amanpreet Kaur
Additive Manufacturing, 2019
152019
A Nonlinear Transmission Line Based Harmonic RF Tag
PC Saikat Mondal, Mohd Ifwat Mohd Ghazali, Saranraj Karuppuswami, Amanpreet Kaur
Electronic Components and Technology Conference (ECTC), 2017 IEEE 67th, 2237 …, 2017
14*2017
Capillary Condensation Based Wireless Volatile Molecular Sensor
PC Saranraj Karuppuswami, Nophadon Wiwatcharagoses, Amanpreet Kaur
Electronic Components and Technology Conference (ECTC), 2017 IEEE 67th, 1455 …, 2017
13*2017
3D Printed Metalized Plastic Waveguides for Microwave Components
PC Mohd Ifwat Mohd Ghazali, Kyoung Youl Park, Vincens Gjokaj, Amanpreet Kaur
International Symposium on Microelectronics 2017 (1), 000078-0000, 2017
132017
Deep Subwavelength Power Concentration-Based Hyperbolic Metamaterials
A Kaur, S Banerjee, W Zhao, J Venkataraman, Z Lu
International Journal of Optics 2012, 2012
102012
An RF backscatterer system for real-time multi-sensing applications
PC Deepak Kumar, Saikat Mondal, Amanpreet Kaur, Yiming Deng
Sensors and Actuators A: Physical, 111685, 2019
8*2019
Reduced graphene oxide based Schottky diode on flex substrate for microwave circuit applications
A Kaur, X Yang, KY Park, Park, P Chahal
Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd, 1037 …, 2013
82013
Multi-band Harmonic RF Tags for Barcode Applications in a Cluttered Environment
PC Saranraj Karuppuswami, Mohd Ifwat Mohd Ghazali, Amanpreet Kaur
Electronic Components and Technology Conference (ECTC), 2017 IEEE 67th, 1861 …, 2017
7*2017
Low-loss RF filter through a combination of additive manufacturing and thin-film process
PC Leonardo Hernandez, Yuxiao He, Amanpreet Kaur, John Papapolymerou
2017 IEEE Radio and Wireless Symposium (RWS), 114-116, 2017
72017
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Artikler 1–20