Packaging and assembly challenges for 50G silicon photonics interposers B Snyder, N Mangal, G Lepage, S Balakrishnan, X Sun, N Pantano, ...
Optical Fiber Communication Conference, Tu2A. 3, 2018
29 2018 Expanded-Beam Through-Substrate Coupling Interface for Alignment Tolerant Packaging of Silicon Photonics N Mangal, J Missinne, G Roelkens, JV Campenhout, GV Steenberge, ...
2018 Optical Fiber Communications Conference and Exposition (OFC), paper Tu2A.1, 2018
16 * 2018 Alignment-tolerant interfacing of a photonic integrated circuit using back side etched silicon microlenses J Missinne, NT Benéitez, N Mangal, J Zhang, A Vasiliev, ...
Silicon Photonics XIV 10923, 1092304, 2019
10 2019 Performance Evaluation of Backside Emitting O-Band Grating Couplers for 100- N Mangal, J Missinne, G Van Steenberge, J Van Campenhout, B Snyder
IEEE Photonics Journal 11 (3), 1-11, 2019
9 2019 Monolithic integration of microlenses on the backside of a silicon photonics chip for expanded beam coupling N Mangal, B Snyder, J Van Campenhout, G Van Steenberge, J Missinne
Optics Express 29 (5), 7601-7615, 2021
8 2021 Expanded-beam backside coupling interface for alignment-tolerant packaging of silicon photonics N Mangal, B Snyder, J Van Campenhout, G Van Steenberge, J Missinne
IEEE Journal of Selected Topics in Quantum Electronics 26 (2), 1-7, 2019
7 2019 Through-substrate coupling elements for silicon-photonics-based short-reach optical interconnects N Mangal, J Missinne, J Van Campenhout, G Van Steenberge, B Snyder
Optical Interconnects XIX 10924, 37-48, 2019
6 2019 Packaging silicon photonics with polymer waveguides for 3D electro-optical integration N Mangal, J Missinne, G Van Steenberge, J Van Campenhout, B Snyder
2017 IEEE Photonics Conference (IPC), 707-708, 2017
6 2017 Ball lens embedded through-package via to enable backside coupling between silicon photonics interposer and board-level interconnects N Mangal, J Missinne, J Van Campenhout, B Snyder, G Van Steenberge
Journal of Lightwave Technology 38 (8), 2360-2369, 2020
5 2020 Integration of Ball Lens in Through-Package Via to Enable Photonic Chip-to-Board Coupling N Mangal, J Missinne, JV Campenhout, GV Steenberge, B Snyder
Electronic Components and Technology Conference (ECTC), 2018 IEEE, 2018
5 2018 Alignment-tolerant coupling interfaces for board-level integration of silicon photonics N Mangal
Ghent University, 2020
1 2020 SOI strip waveguide microring resonator for homogeneous biosensing S Malathi, N Mangal, SA Samad, RV Honnungar, T Srinivas
Novel Optical Systems Design and Optimization XIV 8129, 96-102, 2011
1 2011 SOI Based Integrated-Optic Microring Resonators for Biomedical Sensing Applications N Mangal
2018 Laser processing for large area polymer photonic applications G Van Steenberge, E Bosman, J Missinne, K Kaur, S Naithani, ...
8th International Symposium on Flexible Organic Electronics (ISFOE15), 2015
2015 
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