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Kin Man YuDepartment of Physics, City University of Hong KongVerified email at cityu.edu.hk
Sriram KrishnamoorthyUniversity of California, Santa BarbaraVerified email at ucsb.edu
Junqiao WuProfessor of Materials Science, University of California, BerkeleyVerified email at berkeley.edu
Dr. Cynthia FurseUniversity of Utah, Livewire InnovationVerified email at ece.utah.edu
Joel B. HarleyAssociate Professor, University of FloridaVerified email at ufl.edu
Samuel KingstonPhD, University of UtahVerified email at utah.edu
Ashish BhatiaUniversity of UtahVerified email at utah.edu
Sudhajit MisraIntel CorporationVerified email at intel.com
Berardi Sensale RodriguezThe University of UtahVerified email at alumni.nd.edu
Mashad Uddin Saleh, Ph.D.Test R&D Engineer, Intel CorporationVerified email at utah.edu
Rujun SunSchool of Microelectronics, Xidian UniversityVerified email at xidian.edu.cn
Kenji YoshinoUniversity of MiyazakiVerified email at cc.miyazaki-u.ac.jp
Arkka BhattacharyyaUniversity of California Santa BarbaraVerified email at ucsb.edu
Praneeth RangaUniversity of UtahVerified email at utah.edu
Chris FerekidesUniversity of South FloridaVerified email at usf.edu
Michael J. AzizGene and Tracy Sykes Professor of Materials and Energy Technologies, Harvard School of EngineeringVerified email at harvard.edu
Brian SimondsNational Insitute of Standards and TechnologyVerified email at nist.gov
James R nageluniversity of utahVerified email at utah.edu
Ayobami S. EdunUniversity of Florida (PhD Student)Verified email at ufl.edu
Vasilios PalekisUniversity of South FloridaVerified email at mail.usf.edu
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Michael A. (Mike) Scarpulla
Associate Professor, MSE & ECE, University of Utah
Verified email at utah.edu - Homepage